Snapdragon 865
Snapdragon 865 is the flagship level chipset and comes with 5G support. It can be paired with the Snapdragon X55 modem, which was launched earlier this year and succeeds the X50 modem with the more power-efficient process. The X55 has higher down/up speeds and supports both SA/NSA networks.
The Snapdragon 865 will feature an improved AI engine and it will be capable of 15 TOPS (Trillion Operations Per Second), which according to the company is more than twice the Snapdragon 855. Its new ISP comes with 2 gigapixels per second processing speed. It will be capable of shooting 8K videos, decoding 8K videos at 60fps and up to 200 MP camera support. Moreover, it will offer up to 25 percent increase in graphics capabilities. The new chipset will be seen in flagship smartphones from brands such as Oppo, Xiaomi, Realme ZTE and more in early 2020.
Snapdragon 765 & 765G
Snapdragon 765 and 765G were the other two SoCs announced at the event. These are more interesting offerings as they feature an integrated Snapdragon X52 5G modem.
The Snapdragon 765 and 765G are said to offer enhanced capabilities such as 5th Gen AI Engine, 4K 60 HDR10+ support, 4K HDR capture with computer-vision ISP, and support for up to 192-megapixel camera sensors. Qualcomm hasn’t shared more details about these chipsets yet and it may reveal them during the next two days of the summit. These chips will be seen in more affordable phones and Xiaomi & HMD Global will be announcing their phones with these soon.
3D Sonic Max Fingerprint Sensor Tech
Qualcomm also announced its next-gen ultrasonic fingerprint sensor technology which is called 3D Sonic Max. The new technology is said to offer a 17x larger fingerprint recognition area than the previous generation. Interestingly, it will also come with support for the authentication of two fingers simultaneously.
